ASMPT and SPIL announce Joint Investment Venture in Molded Interconnect Substrates

high tech bedrijven asm pacific technology

ASM Pacific Technology Limited (“ASMPT”) and Siliconware Precision Industries Co., Ltd. (“SPIL”)announced today that both companies will enter into an agreement to establish a joint investment entity to develop and manufacture molded interconnect substrates (“MIS”) to meet the industry’s demand for advanced semiconductor chips with greater functionality.

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