ASMPT Wins the 2015 Hong Kong Awards for Industries: Technological Achievement Grand Award

hightechbedrijven asmpt 151215

In developing a solution that is truly making a difference in semiconductor manufacturing, ASM Pacific Technology Limited (“ASMPT”), a world leader in the supply of semiconductor assembly and packaging equipment and materials as well as surface mount technology solutions, received the 2015 Technology Achievement Grand Award for its Thermo-Compression Bonding (TCB) tool.

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