Is Fan-out Wafer-level Packaging Right for Your Product?

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New CAD tools feature virtual prototyping for evaluating effects of packaging architecture on functionality, cost, weight and size.

Fan-out wafer-level packaging (FO-WLP) technology has picked up considerable momentum since it was selected by Apple for use in the iPhone 7. FO-WLP establishes die-to-die and die-to-ball grid array (BGA) connectivity directly through packaging redistribution layers (RDLs), eliminating the packaging substrate used in more-established flip-chip and wafer-level chip scale packages (WLCSP). Read more [Source: pcdandf.com]

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