Kulicke & Soffa Continues to Gain Traction with its Advanced Packaging Solutions

Kulicke & Soffa Industries, Inc., continues to expand its presence in the advanced packaging market, through focused feature development and strategic customer engagement.

K&S has a complete offering of advanced packaging solutions supporting Fan-Out Wafer Level Packaging (FOWLP), Wafer Level Packaging (WLP), Flip Chip, System-in-Package (SiP), Package-on-Package (PoP), Embedded Die and Thermo-Compression Bonding (TCB).

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