Kulicke & Soffa Industries today announced the formal launch of its new FCC™ Hub Blades, extending the successful AccuPlus™ series. The new FCC™ Hub Blades offer a customizable solution for flip chip, wafer level packaging (WLP) and thick wafer dicing with improved efficiency and cost of ownership.
The advanced packaging market, flip chip and WLP wafer dicing demand has increased exponentially.
These advanced packaging technologies further enable package size reductions for the most advanced processor and memory devices serving the latest smart phone and tablet segments which generally requires high accuracy and dicing consistency. K&S FCC™ Hub Blades are designed to fulfill the growing process requirement.