Parallelism in Photonics Alignment Automation: Key to Economic Test & Packaging

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Compared to the devices typical of the telecom revolution of two decades ago, today’s typical Silicon Photonics (SiP) devices present more channels, smaller form factors, and exponentially higher production quantities. Transverse alignment tolerances well below 50nm are common, and multi-channel inputs and outputs necessitate at least an additional theta-Z alignment in order to optimize and balance the couplings across the input or output array. Very often the theta-X and theta-Y orientations must be optimized as well, and Z gaps must be set by vision or by contact sensing, or by a waist-seeking approach in lensed applications.

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