Teledyne DALSA Introduces Wafer Level-Packaging to its LWIR Imaging Platform

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Teledyne DALSA, a Teledyne Technologies company and global leader in image sensing technology, will demonstrate its Wafer-Level-Packaged (WLP) 320 x 240 Vanadium Oxide microbolometer at the upcoming Defence & Security Equipment International Show (DSEI) UK in booth S10-268. In addition, the company will display its real time LWIR-Visible image fusion OEM sub-system, which is configured from the Calibir™ Camera and Core platform. A live feed from the show floor will provide visitors with an opportunity to observe real-time image fusion from the Teledyne booth.

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