ASMPT has developed a proprietary process with a unique V-DOE Multi beam process for dicing of thin silicon (<<100 µm) wafers with a low CoO while achieving a high die strength (typically >500 MPa). Read more
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ASMPT has developed a proprietary process with a unique V-DOE Multi beam process for dicing of thin silicon (<<100 µm) wafers with a low CoO while achieving a high die strength (typically >500 MPa). Read more
