With the growing demand for data to improve yield in tier-one fabs, advanced packaging, and 3D integration, EDA is becoming a baseline expectation for equipment entering the world’s most advanced fabs. There is therefore some urgency for semiconductor equipment OEMs to start working on an EDA adoption path that will deliver compliant production machines to global fab customers ahead of SEMI’s anticipated EDA Freeze 3 release this year. OEMs that act early will be better positioned to manage Freeze 2 deployments today, prepare for Freeze 3 tomorrow, and offer fab customers a cleaner, safer, and more scalable path toward data-driven manufacturing. Read more (Picture source: Agileo Automation on linkedin.com)
