When a single beam laser cuts with acceptable speed, it generates too much heat damage on a wafer, impacting the quality. To improve the quality of the cut, less laser power has to be applied; however, this reduces the cutting speed too much. Multiple beams cutting limits the local heat load sufficiently while it achieves a high removal rate. Read more and watch the video

Because the industry is moving towards SiC and GaN wafer substrates, other requirements and wafer separation technology is needed to dice through these materials at low costs and high productivity. Also the quality of cutting processes is becoming more important, with the trend of electrical performance of power semiconductor devices increasing. Read more and watch the video

ASMPT the leading global provider of hardware and software solutions for the manufacture of semiconductors and electronics, has reached another milestone in its long and successful history. The company has aligned all its segments, business units and regions worldwide under one brand, ‘ASMPT’. Watch the video

The two main requirements for any separation process are a superior cutting quality – in terms of visual appearance and structural integrity of the cut – and a low throughput time. The latter depends to a great extend on the dicing speed thus the material removal rate of the process. In the case of laser dicing both requirements are generally speaking diametrical opposed to each other. The material removal rate scales with increasing laser power, the dicing quality deteriorates accordingly. Typically a fast laser separation process comes along with a wide cut, rough edges, increased volumes of recast and burr as well as a pronounced heat affected zone (HAZ). Read more and watch the video

Last week ALSI shipped the first high power ultra-short pulse LASER1205 grooving system to a customer with a leading position in the display industry. By the application of new technology and close customer collaboration new frontiers are defined for minimal burr height, higher die strength and cost effective UPH for laser grooving applications.

The two main requirements for any separation process are a superior cutting quality – in terms of visual appearance and structural integrity of the cut – and a low throughput time. The latter depends to a great extend on the dicing speed thus the material removal rate of the process. In the case of laser dicing both requirements are generally speaking diametrical opposed to each other. Read more

As in all precision machines, the accelerating mass of the stage introduces deformation and vibrations in the frames, negatively influencing attainable accuracy. This effect is counteracted by an active mount system: linear motors generate counter forces in the frame that will keep vibration on a minimal level. These counter forces are both feed forward signals from the stage motions, and feed back signals to suppress disturbances introduced by the facility floor. Watch the video

Multi beam Matrix laser grooving process allows full removal (grooving) of the top layers (Low-K, Metals and passivation, etc). The multi beam matrix grooving process creates a U-Shape groove profile with consistent industry standard quality (low burr, no chipping, smooth groove profile). The unique slider concept (wafer stepper concept) allows high accuracy and reproducibility. Together with unique and patented “kerf check on the fly” the customer has continuous process control. Read more