Adjacent to the oldest city of Netherlands lies Beuningen, home to ASMPT ALSI. Founded in 2001, the Beuningen office is also where we invented the multi-beam laser dicing and grooving technology. It has since emerged to become a market leader in wafer processing and one of our key R&D centres for identifying new innovation opportunities. Read more

When a single beam laser cuts with acceptable speed, it generates too much heat damage on a wafer, impacting the quality. To improve the quality of the cut, less laser power has to be applied; however, this reduces the cutting speed too much. Multiple beams cutting limits the local heat load sufficiently while it achieves a high removal rate. Read more and watch the video

Because the industry is moving towards SiC and GaN wafer substrates, other requirements and wafer separation technology is needed to dice through these materials at low costs and high productivity. Also the quality of cutting processes is becoming more important, with the trend of electrical performance of power semiconductor devices increasing. Read more and watch the video

ASMPT the leading global provider of hardware and software solutions for the manufacture of semiconductors and electronics, has reached another milestone in its long and successful history. The company has aligned all its segments, business units and regions worldwide under one brand, ‘ASMPT’. Watch the video