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ASMPT ALSI

Company

ASMPT ALSI is the inventor of multi-beam laser dicing and grooving. The multi laser beam dicing and grooving process is the technology with very low thermal impact while having a very high productivity. ASMPT ALSI’s solutions enable you to reduce your manufacturing cost significantly and to execute your semiconductor technology road map.

Technology

To enable the low cost of ownership all modules within the system support and contribute to achieve this proposition. To keep up with the demanding semiconductor market, continuous technology development enables; smaller, better and more cost effective products for wafer dicing and grooving applications.

Products

We offer laser dicing and grooving systems that enable the lowest cost of ownership through the shortest process time and high flexibility. This ensures that ASMPT ALSI’s laser systems are ideally suited for your application.

Application

We develop laser dicing and grooving solutions that enable semiconductor manufacturers to reduce the product manufacturing cost through yield improvement, higher productivity, and increased number of dies per wafer. Our expertise is in RFIC, LED, IC, Low-K and Discrete.

Bedrijfsnieuws

How Laser is enabling the Power Semiconductor Roadmap

September 29, 2023

Because the industry is moving towards SiC and GaN wafer substrates, other requirements and wafer separation technology is needed to dice through these materials at low costs and high productivity. Also the quality of cutting processes is becoming more important, with the trend of electrical performance of power semiconductor devices increasing. Read more and watch the video

We are ASMPT

March 31, 2023

ASMPT the leading global provider of hardware and software solutions for the manufacture of semiconductors and electronics, has reached another milestone in its long and successful history. The company has aligned all its segments, business units and regions worldwide under one brand, ‘ASMPT’. Watch the video

Laser separation technique: Multiple Laser Beam Technology (MLBT)

November 7, 2020

The two main requirements for any separation process are a superior cutting quality – in terms of visual appearance and structural integrity of the cut – and a low throughput time. The latter depends to a great extend on the dicing speed thus the material removal rate of the process. In the case of laser dicing both requirements are generally speaking diametrical opposed to each other. The material removal rate scales with increasing laser power, the dicing quality deteriorates accordingly. Typically a fast laser separation process comes along with a wide cut, rough edges, increased volumes of recast and burr as well as a pronounced heat affected zone (HAZ). Read more and watch the video

First high power ultra-short pulse LASER1205 grooving system shipped

September 22, 2020


Last week ALSI shipped the first high power ultra-short pulse LASER1205 grooving system to a customer with a leading position in the display industry. By the application of new technology and close customer collaboration new frontiers are defined for minimal burr height, higher die strength and cost effective UPH for laser grooving applications.

Multibeam Process

August 22, 2020

The two main requirements for any separation process are a superior cutting quality – in terms of visual appearance and structural integrity of the cut – and a low throughput time. The latter depends to a great extend on the dicing speed thus the material removal rate of the process. In the case of laser dicing both requirements are generally speaking diametrical opposed to each other. Read more

Active Mounts

June 4, 2020


As in all precision machines, the accelerating mass of the stage introduces deformation and vibrations in the frames, negatively influencing attainable accuracy. This effect is counteracted by an active mount system: linear motors generate counter forces in the frame that will keep vibration on a minimal level. These counter forces are both feed forward signals from the stage motions, and feed back signals to suppress disturbances introduced by the facility floor. Watch the video

LASER1205 >> UV GROOVING

March 27, 2020


Multi beam Matrix laser grooving process allows full removal (grooving) of the top layers (Low-K, Metals and passivation, etc). The multi beam matrix grooving process creates a U-Shape groove profile with consistent industry standard quality (low burr, no chipping, smooth groove profile). The unique slider concept (wafer stepper concept) allows high accuracy and reproducibility. Together with unique and patented “kerf check on the fly” the customer has continuous process control. Read more