Changing standard components in an electrical system is a common task but it entails a number of time-consuming checks that engineers must carry out to avoid trouble. For example, replacing a windscreen wiper motor may seem like a simple task, but what if the new motor is more powerful? Read more

We’ve all heard of PCB design constraints. They’re those little things that limit our ability to create the perfect board in very short periods of time. But what exactly are they? And why do they matter? This blog post elaborates on PCB constraints and why they should drive your design flow. Read more

Zuken, a global leader in the area of software and solutions for electronic and electrical engineering, and Compound Semiconductor Applications (CSA) Catapult are announcing an important milestone in their R&D collaboration aimed at building a development environment for state-of-the-art compound semiconductor products. Read more

Autonomous vehicles are posed to increase the safety of roadways and improve mobility for millions of Americans. The Autonomous Vehicle Caucus aims to make this a reality. Zuken supports these efforts with our high-quality, proven software for system design. Watch the video

Zuken announces the release of E3.series 2022, introducing enhancements to empower design teams to create digital twins with functional and manufacturing details captured in a single cutting-edge tool suite. The enhancements to E3.series 2022 cover all areas of electrical design through to the manufacturing process, including: wire routing, data visualization, design rule checks, change management, and much more. More info

This flexible & scalable platform adjusts to your application so you can pick and choose only the test requirements you need. Let UniLine solve: Functional / Safety / ICT / Inspection / End-of-Line Test and more! Applicable to any industry, standardized test simplifies manufacturing and delivers results. Watch the video and Learn more

Electrical and electronic design data represent a valuable investment, which should be used and reused as much as possible. In today’s rapidly changing business environment with mergers and takeovers, changing business relations, and technological progress, you may frequently become confronted with changing tools and formats. Read more

E3.Connectivity-Browser is the only application able to read a pure digital connectivity data model and generate automatically high-quality schematic diagrams on the fly. Read more

EREMS, a French enterprise specializing in the design and realization of high-tech electronic equipment and of associated software for Space, Defense, and Aeronautics uses CR-8000 and DS-CR from Zuken for the design and lifecycle management of flight electronics, ground electronic equipment, and test benches. Read more

Zuken and SnapEDA, a leading provider of verified online electronic components, are announcing a new capability that provides users of Zuken’s eCADSTAR PCB Design Tool Suite with direct access to SnapEDA’s comprehensive online library. Read more

High-speed circuits are used more or less everywhere in electronic applications today. As a result, the importance and the mechanisms of impedance (here in the meaning of PCB trace impedance – typically referred to as “characteristic impedance”) for signal integrity have been widely discussed and seem to be generally well understood by PCB designers. Read more

Today’s smart and connected products require the interaction of different components and systems. They are therefore often described as “Systems of Systems” (SoS). Engineers develop their elements in different engineering disciplines and departments. These disciplines speak different engineering languages and require unique views of the same product. Read more

Zuken is releasing the latest edition of CR-8000, focusing on analysis and reuse. The CR-8000 2021 release features more than 150 enhancements across the tool suite ranging from architectural planning, system-level schematic design and verification, 3D multi-board and advanced packing layout, through to manufacturing outputs generation. The release puts specific emphasis on facilitating improved design efficiency through the benefits of early analysis. Read more

Digital Transformation is a trend that has seen growing momentum over the last decade. Today, it is adapted more and more in all areas of economy, state, society, and everyday life, and due to the current Covid-19 situation, it is experiencing a massive boost. It is therefore worthwhile to take a deeper look to understand its potential impact on the methods and processes in electrical and electronic engineering. Read more

E3.series 365 provides time-based licensing models for time-critical engineering projects in a locally distributed work environment. Read more

In the light of recent digitisation initiatives, circuit documentation has also come up for discussion. Specifically, the question arose as to whether or not a separation between circuit definition and visualization would make sense. In other words: wouldn’t it be a great idea to store electrical data as a digital model, and to display it in a way that is suitable for each target group? Read more

Your systems engineers are experts in their domain. They provide a unique skill set that is hard to find in the industry. It often takes years of experience to refine and hone their capabilities. Doing systems work is not easy. And systems practices can make a tangible difference. Read more

ONTEC faced a difficult challenge: develop a multimedia broadcasting product while complying with a customer’s electromagnetic interference requirements, all within a tight development schedule. ONTEC used Zuken’s CR-8000 with Keysight’s ADS (including SiPro) to meet the requirements of the challenge. Read more

Customer demands and marketplace competition are placing engineers under mounting time pressures. An organization’s development schedules must shorten to keep pace with the industry and the wider market. Many established digital tools are now available to accelerate development lifecycles. Simulation is one of them. Engineers use digital simulation-driven design to expedite innovation and move product development forward. Read more

Zuken reveals details of release 2020 of its advanced 3D multi-board EDA environment CR-8000. Key development themes for CR-8000 2020 are shown via this link

Zuken announces the CR-8000 2020 release of its advanced 3D multi-board EDA environment. The latest release was developed in close collaboration with Zuken’s global customers in business sectors, including electronics, high tech, automation, automotive, aerospace, and defense. Read more

Zuken has available adapters to work with PDM/PLM software applications like SAP, Teamcenter, and Windchill. This creates a connection for both E3.series project and library data to the third-party PDM applications. Read more

Manufacturing wants to leap into the world of the Jetsons. But there is one small problem: every time leadership consults a compass, it shows a different way forward. At first, there was digital automation, which was soon replaced by digitization. Then—to the horror of spell checkers everywhere—digitization transformed into digitalization. Now the compass is pointing toward digital transformation for product development. Read more

Zuken’s free PCB Design Software, CADSTAR Express, provides a quick and easy way for you to experience the basic features of our standard single-board PCB design software solution, CADSTAR. It includes all the core functionality of CADSTAR 2019, limited to 300 pins and 50 components, plus the opportunity to experience Zuken’s place and route editor tool P.R.Editor XR 2000. Read more

One of the fundamental requirements of an effective design process is its ability to produce high-quality products with the least input and overhead. A process without a robust in-design error and functional analysis will inevitably face quality and reliability challenges. The most successful product design teams in electrical or any other design stream all have a rigorous design validation process. Read more

Design Force combines traditional 2D design with native 3D design and the latest human interface techniques, accelerated graphics and almost instantaneous rendering and refreshing. It is the fastest, most effective PCB design solution available today. Read more

OTSAW, which is Hebrew for ‘house of treasures’, uses Zuken’s E3.series for the electrical design for its robots; from initial concept through to the creation of detailed schematics and bills of materials needed for the manufacture of the wiring harnesses. Read more

Double Data Rate 5 (DDR5) is the next-generation standard for random-access memory (RAM). The new specification promises to bring chips that have much higher performance than the existing DDR4 modules, as well as lower power consumption. Let us show you how you can be first to market with DDR5! Read more

Although we’re still a long way from General Artificial Intelligence, machines have become very good at some tasks. Here are five uses of AI that have become prominent in the last five years. Read more

The arrival and evolution of additive manufacturing in the mechanical world is something that people are now familiar with. The fact that it is beginning to have a similar impact in other domains of application such as medical and electrical functionality is now becoming more obvious. Read more

“The acquisition of Vitech advances Zuken’s strategy to become a leader in digital engineering solutions,” said Jinya Katsube, Chief Operating Officer at Zuken, Inc. “Zuken is now uniquely positioned with solutions in both systems engineering and detailed design to take a leadership role in the development of electrical and electronic model-based design practices from product definition to manufacturing.” Read more

Time is money in the engineering world. Every step in the design process is under increased scrutiny to reduce cycle time while maintaining accuracy while projects grow more complex by the minute. The E3.series software suite offers a number of add-on tools that will increase productivity by facilitating or automating common processes and by offering more intuitive interfaces for design environments. Read more

In the future, designers will process the entire workflow for developing a product using various software tools. There doesn’t appear to be a comprehensive tool that will cover all requirements of the different disciplines with all their specialties. Considering the rising number of smart tools across the board – cross functionality is a growing challenge that is bound to get increasingly difficult to resolve. To maintain a best-in-class solution, the connection between these tools is paramount to success. Read more

Every day, more and more of our lives become connected with IoT technology. With billions of smart products already out there, the demand for this technology shows no signs of slowing down anytime soon. Even with increasing demand, executives are asking engineers to develop products on shorter and shorter design cycles. One area for improvement is a collaboration between electrical and mechanical engineers during the board development process. Read more

Zuken introduces E3.WiringSystemLab, a new software solution that enables the optimization of complex wire harness designs based on inputs from heterogeneous sources. The product can import connectivity information from a broad range of sources and consolidates them with 3D topology data. The resulting 3D topology can be evaluated and optimized in a consistent 3D environment that has been designed to support the needs of casual users without requiring specialized training. Specialized functionality tailored specifically to topology exploration provides. Read more

PCB design tools were built on 2D software methods in the 1980s. Many of today’s design tools still use that 2D code base. Mechanical tools have moved on to native 3D design. PCB has been stuck more or less in the 2D world. Extensions to the 2D code base made 2.5D and 3D visualization possible. But designing in 3D requires the tool to be built on a 3D kernel. Article

Westford, MA, USA – Zuken Inc (6947:TYO) today announced an agreement to purchase Vitech Corporation for an undisclosed amount. Vitech is a global solutions company based in Blacksburg, VA, United States, specializing in systems engineering, with products and services directed at the Model-Based Systems Engineering (MBSE) market. Read more

For me nothing bridges the gap between the present and the future more than electric flight. I’ve spent my whole career in the electronics industry and this sector captures my imagination more than any other. These are particularly exciting times for the aerospace industry because, not only is interest in electric flight on fast charge but, with developments in AI, there’s also talk of pilotless flight. Here are some sector updates that have caught my attention in the past few months… Read more

PCB designers working with advanced and complex designs are constantly pushing the boundaries to satisfy the signal integrity of routed differential pairs and busses. Those who work with flexible and flex-rigid PCB designs are perhaps the most demanding of all. Read more

Zuken has signed a partnership agreement with CADENAS, a leading provider of online component libraries, and ECAD-Port, a specialized provider for electrical components library services. Read more

UK-based Electroflight has recently selected E3.series, Zuken’s electrical and fluid engineering solution. Specialists in high performance electric powertrains, Electroflight is using E3.series to design, build, test and commercialize an all-electric aircraft – all within a 24-month timeframe – as part of the Accelerating the Electrification of Flight (ACCEL) research initiative. Read more

Using feedback from products in the field to continuously improve design modules used as the basis for product development can increase product performance and reliability and reduce development time.

OEMs have made enormous strides in feeding back information from the manufacturing process into design to increase process yields. Metrics important to customers such as performance, reliability and usability would be much more useful inputs to the design process, but traditionally they have been much more difficult to obtain. Now Internet of Things platforms can collect and analyze this information and modular design systems can present it to designers in context. Read more [source: eetimes.com]

Man-carried military communication systems often consume large amounts of power. The heat must be removed from the electronics package to avoid frying sensitive electronic components. The package typically is designed to be carried in a backpack which often puts difficult constraints on the form factor and weight of the system. A military system integrator approached Additive Design Consultancy with the challenge of providing a thermal management solution for a 14 by 10 by 5 inch system. Read more

Zuken CR-8000 Design Force Now Connects with Polar Speedstack PCB Stackup / ECAD Interface Read more

The silicon brains of today’s warfighters are just as complex as their alloy exteriors, requiring engineers like those at Lockheed Martin to have mastery of not only aeronautics and flight, but also advanced computing and electronics. Read more

The space industry is engaged in a remarkable technological transformation from primarily government-driven stand-alone projects to a private industry-driven supply chain collaborating to create exciting new services for businesses and consumers. The key technology trends that are driving the new space industry are recyclable and smaller launch vehicles that are reducing the cost of putting satellites into orbit. Another key trend is smaller satellites, weighing from less than one to a few hundred pounds, that lower the barrier to entry for new space applications. Read more

The latest release of Zuken’s electrical and fluid engineering solution, E3.series, addresses the challenge of growing complexity within today’s products and processes. Key enhancements lie in the areas of topology planning, modularity support and variant handling, which are designed to support the requirements of manufacturing companies using modular product design to control complexity. Read further

Aircraft electrical design projects tend to be very large and extremely complex. The challenges associated with managing the sheer number of wires (required for avionics systems, engines, sensors, in-flight-entertainment etc.) is frequently compounded by the distances some signals must travel within the airframe, passing through several harnesses on route. For example, an Airbus A380 – with its wingspan of almost 80m and a nose-to-tail length of almost 73m – allegedly has around 480km (300 miles) of wiring. Read more

Zuken’s wire harness visualization and analysis software, E3.HarnessAnalyzer, has been enhanced and extended to support the latest industry standard data formats, visualize harness data in 3D, and automatically compile schematic drawings for the displayed modules.

With these capabilities, E3.HarnessAnalyzer enables OEMs and suppliers to open, inspect and collaborate on previously proprietary harness design data generated by different authoring tools used in the industry.

In the 2018 release of CR-8000 Design Force, an amazing new improvement has been made to reinforce via. In this video is explained how this cool new feature works.

In CR-8000 Design Force, the Generate Bump utility allows the designer to add a bump line either single or sequentially to a differential pair route. Bump line size, style and space can be set in the dialog. Accurate length differences can be seen in the Constraint Browser during this process.

While the concept of a digital twin has been around since the early 2000s, it’s only thanks to the Internet of Things (IoT) that its time has come. It was recently named one of Gartner’s Top 10 Strategic Technology Trends for 2018.

Simply speaking, a digital twin is a virtual model of a process or product, which is paired to the physical world. This approach allows the analysis of data and creates a wide range of new technical and commercial opportunities.

There is one thing that all design engineers will agree on: creating and gathering all the required data for PLM is error-prone and can be a royal pain. We all understand the value of releasing our design data to the corporate PLM system but our design process dictates multiple release points, and each one has a different purpose and data requirements.

Zuken® and XJTAG®, a leader in boundary scan and design for test technology, have released a plugin that will enhance Zuken’s CR-8000 with a design for test (DFT) capability improving test coverage by allowing additional design checks during schematic entry. The capability is based on XJTAG’s DFT Assistant and will be released as a free plugin for Zuken’s CR-8000 Design Gateway users at Embedded World 2018 in Nuremberg, Germany.

Several years ago, automotive supplier EFA France realised they were expanding at a rate beyond which their current electrical design setup could manage. With plans to increase their global turnover, while maintaining the high level of quality in their products that had caused their business to prosper in the first place, they needed a new solution.

Advanced packaging techniques such as system-in-package (SiP), fan-out wafer-level packaging (FOWLP), 3D die stacks, etc. have been around for over a decade, yet with any other EDA design tool, it is still a tedious, time consuming, and error-prone process to implement these designs. It seems surprising that there are so few reliable EDA solutions out there, but CR-8000 Design Force is definitely the tool to look to when tackling advanced package design! Take a look below and see why.

As we witness the birth of an era of connected devices with smart homes, connected cars and smart networked supply chains and factories, we might imagine that unexpected failures of electronic products would be a rarity. But all too often we hear about cellphones going up in flames, airbags that deploy on their own, or drones falling out of the sky. It is estimated that in the automotive industry alone, global warranties amount to as much as $40 billion USD per year.

Traditionally, the automobile business spends a year or two designing a new vehicle, then another year or two building tools to produce it in high volumes. Local Motors has turned that paradigm on its head with its Olli, the self-driving, electric shuttle which is designed for use in neighborhoods, universities, corporate campuses, airports, etc. The Olli’s design can be customized to fit a customer’s application. Then the new design can be produced in small quantities with the aid of 3D printing in a few more weeks. Composite body panels are produced from 3D printed thermoforming molds and other 3D printed plastic parts are directly installed in the vehicle. “We believe that 3D printing will revolutionize the automobile industry by making it possible to quickly produce new vehicles to meet special applications and customer tastes,” said Matthew Rivett, Chief Operating Officer of Local Motors.

Each new generation of automobiles has an increasing number of electronic systems that require communications with other vehicle systems at ever higher speeds. The proliferation of advanced driver assistance systems (ADAS) with fully autonomous vehicles on the horizon has greatly increased the amount of bandwidth that must be transferred between the many processors, cameras, radar units, display head units, etc. on current and next-generation vehicles. Today’s high-end vehicles have 70 or more electronic control units (ECUs) that implement hundreds of distributed functions including bandwidth-intensive applications such as collision lane departure warning systems, collision avoidance systems and automatic high-beam switching.

Over the course of the past couple of years, I’ve been digging deeper and deeper into system engineering. Very frequently, that means using methodologies to deal with the complexities of designing across multiple engineering disciplines. Yet, that’s not always the case. There are many instances where the complexity of a design is high within a single engineering discipline. That’s certainly true of today’s multi-boards systems and wire harnesses. Read more [source: lifecycleinsights.com]

Feeling a bit dazed by the multitude of electrical applications available to you?

With Zuken’s E³.series containing a host of products including E³.schematic, E³.fluid, E³.cable, E³.formboard, E³.panel, E³.RoutingBridge, E³.PLCBridge and E³.Wiring Diagram Generator, you may feel overwhelmed on your  first approach. Well, you’ve got nothing to worry about! I’ll walk you though and provide you with a guide to figuring it all out.

DDR4, the fourth generation of DDR SDRAM technology, is the latest and greatest SDRAM standard and will continue to be until the fifth generation is released. The new standard features a point-to-point architecture that offers superior timing margins. In theory, this should make signal integrity easier to achieve since the designer has more leeway in routing and length matching of the different bit, clock and address lines, assuming operation at the same data rates. But most real-world designs are going to take advantage of DDR4’s ability to double the maximum rate and in this case routability will actually be considerably more challenging than with DDR3.

The advent of the Internet of Things (IoT) offers the potential to automatically collect detailed performance information from every device in the field at minimal cost. This field performance data can then be crunched to identify design weaknesses and improve product quality. The most powerful way to use this data is to reorganize the design process by basing it on modules that are continuously improved based on performance feedback.

Zuken, with its E3.series suite, is leading the way in helping companies manage, design and develop products of tomorrow with electro-mechanical complexities such as panels, harnesses, PLCs, and fluid controls. The 2017 release is here to help you be faster, smarter and more effective in being a part of great electrical revolution taking over the broader society.

At this year’s annual conferences (ZIW) across Europe we brought together leading companies in their fields to discuss some the latest electrical and electronic design issues affecting our customers including: ECAD/MCAD integration, PLM integration, augmented reality and PCB package co-design.

In a world increasingly shaped by rapid progression and global market competition, there has been a call to arms in the fields of electrical engineering and design.

As an industry that’s long been defined by Printed Circuit Board-centered (PCB) processes and strategies, the journey to recovery from inherently flawed designs or oversights on budget can be long and incredibly costly. Lees meer [Bron: techwireasia.com]

The PCB design team at Renishaw work with flex PCBs and flexi-rigid boards that require detailed signal integrity analysis.

To achieve the most accurate results they are working with Zuken’s electronic PCB design software to visualize boards in 3D using imported MCAD data. This also ensures that sure high-speed digital signals can be transmitted with minimal distortion.

We all know that manufacturing yields and costs are the driving force behind product development, rather than product quality. You can buy a Design for Manufacturing (DFM) tool, but try buying a Design for Quality tool – good luck! The best way of measuring product quality is finding out how your product performs in the hands of the customer. But measuring product performance, and quantifying quality, is difficult at best for most products. The good news is that more and more devices are becoming part of the Internet of Things (IoT), which extends the design team’s visibility beyond manufacturing – and that changes everything.

New CAD tools feature virtual prototyping for evaluating effects of packaging architecture on functionality, cost, weight and size.

Fan-out wafer-level packaging (FO-WLP) technology has picked up considerable momentum since it was selected by Apple for use in the iPhone 7. FO-WLP establishes die-to-die and die-to-ball grid array (BGA) connectivity directly through packaging redistribution layers (RDLs), eliminating the packaging substrate used in more-established flip-chip and wafer-level chip scale packages (WLCSP). Read more [Source: pcdandf.com]

Zuken and Nano Dimension are working together to advance the 3D printing user experience and prototype turnaround times. Nano Dimension, a leader in electronic printing technologies, will take advantage of the support for implementing electronic technologies provided by Zuken’s market-leading, native 3D, system-level design solution, CR-8000 Design Force.

Zuken has partnered with SamacSys to help companies develop component libraries rapidly, freeing-up time for product innovation.

SamacSys, a leading developer of software tools for creating and managing electronic component ECAD data, has developed a library of free, high-quality PCB symbols and footprints for CADSTAR, Zuken’s desktop PCB design solution. This allows users to search and place components instantly from within CADSTAR, without needing to unzip or load files.

In the electronics and electrical engineering design communities there is plenty of talk about IoT, particularly in relation to the opportunities, but arguably the more pressing issue right now is the need to design for security in the connected world. At the core of this is the concept of ‘trust’, consumers/businesses need to trust product manufacturers to deliver reliable robust products with the necessary defences against criminals. Forging ahead without appreciating the vulnerabilities that IoT security poses for individuals and companies seems irresponsible for those involved in the development and manufacture of connected devices. Video

Consistency isn’t flashy or bragged about in our age of instant gratification. But it’s exactly what you need to thrive and set yourself apart in competitive business conditions. I caught up with Karl-Heinz Kluwetasch, Owner and Manager Director of CSK, who credits his CADSTAR Distributor of the Year 2015/2016 win to a combination of consistent support, customer contact through roadshows, and superior training all under one roof.

Over the past year Zuken has seen a significant increase in the uptake of its E3.series electrical design tool within the motorsport sector. OEMs and suppliers, such as harness manufacturers, are citing a ripple effect that is causing companies to consider adopting E3.series based on word-of-mouth recommendations about the tool’s flexibility, ease of adoption and increased productivity.

Zuken®, and Aras®, a leader in enterprise Product Lifecycle Management (PLM) software, have entered into a partnership to develop a new approach for managing cross-discipline product development processes that include electrical and electronic design data from design creation to manufacturing. The new solution will span enterprise processes across the lifecycle, as well as detailed electrical design and manufacturing.

Kardinal Microsystems has joined Zuken USA’s Startup Partner Program aimed at early to mid-stage companies developing electronic-based products. The new program provides access to state-of-the-art PCB and IC packaging development tools, with special terms designed to accommodate the development needs of an early-stage company.

CAT Racing, the Zuken-sponsored Formula Student race team from Germany’s University of Applied Sciences Coburg made a strong appearance both at the ZIW Germany conference where we celebrated our 40th anniversary as a company and – even more important, one week later at the race track in Varano de´ Melegari in Italy, where the team secured a clear win in their class.

Here in Poland we are currently undergoing a major investment in our own defense capabilities. This may not come as a surprise to people outside of our country, given our geographical position in eastern Europe; not to mention the vast amount of military kit still in use that goes back to the old Soviet days.

Engineers facing extremely tight design cycles will benefit from powerful new multi-user functionality in Zuken’s CR-8000. Concurrent PCB design reduces design time, meaning quicker time-to-market. In addition, a raft of native 3D design enhancements offer more efficient ECAD/MCAD task management and design re-use, plus functionality enabling early validation to reduce iterations and improve design quality.

Special offers for CADSTAR PCB design software available now

Zuken announces industry-leading routing enhancements in the latest version of its CADSTAR desktop PCB design software. Other productivity enhancements include improved routing patterns for differential pairs, and Etch Factor support.

The most advanced production car in the world, the Tesla, is more a computer than a car. The old heart of the automobile replaced by batteries, chips, circuit boards and wiring. These days, a car will have 70 to 100 electronic control units (ECUs), which are based on microprocessors that sit on boards and boxes scattered throughout the vehicle, all connected with wires. For pure mechanical engineers, who in their heydays were at home among gears, pistons and shafts, life has become more complicated. Read more [Source: engineering.com]

Zuken announces that the Microsoft Devices division has selected Zuken’s DS-2 engineering data management solution for library and design data management with supply chain connectivity.

CORONADO ISLAND, CA – During the past 35 years, end-to-end design has been a relatively backburner topic, but Zuken has designs on making that a thing of the past.

In doing so, the PCB software developer is attempting to “harness” what many see as today’s Holy Grail of system design.

Of course, if it hadn’t been for the abundant 30-minute technical sessions over the course of two days in mid April, attendees at Zuken Innovation World might be excused for feeling they were on vacation. [Source: pcdandf.com]

Zuken’s CR-8000 and CR-5000 PCB design platforms will now offer users access to more than 7 million symbols, footprints and 3D STEP models from Accelerated Designs.

In the first part of this blog series (here), I looked at the explosion in the growth of internet connected technology and wearable devices, and started to look at what kind of design challenges this posed; not just for cutting edge niche products, but mass market general electronics goods.

I started to explore the need to collaborate on a mechanical level; but the level of integration really needed to compete in this space goes far beyond that.

Things are really heating up in automotive design and innovation. Last week, the Bosch ICCAD keynote about self-driving cars was covered here, and this week it’s Zuken’s latest automotive-related announcement regarding the launch of E3.HarnessAnalyzer and the acquisition of software IP from Intedis.

Zuken USA Inc announces the acquisition of CAETEK Inc. CAETEK is a software developer and sales partner for electrical design and manufacturing solutions. The addition of CAETEK will strengthen Zuken USA’s product portfolio and coverage in the electrical design space. CAETEK employees and intellectual property will transition to Zuken USA as part of the acquisition.

Things are really heating up in automotive design and innovation. Last week, the Bosch ICCAD keynote about self-driving cars was covered here, and this week it’s Zuken’s latest automotive-related announcement regarding the launch of E3.HarnessAnalyzer and the acquisition of software IP from Intedis. Read more [souce: EDACafe]