The economical mass production of silicon photonics (SiPh) components requires high-speed alignment with nanometer accuracies: With thousands of photonic structures on one wafer, the faster the alignment of the signal-carrying optical fibers to the photonic circuits, the faster and thus more economical testing becomes. Probing solutions must combine high speed and precision with adequate sensor technologies to avoid direct contact between probe and wafer, thereby preventing particle formation and damage to chip structures. Read more
