How Laser is enabling the Power Semiconductor Roadmap
Because the industry is moving towards SiC and GaN wafer substrates, other requirements and wafer separation technology is needed to dice through these materials at low costs and high productivity. Also the quality of cutting processes is becoming more…
We are ASMPT
ASMPT the leading global provider of hardware and software solutions for the manufacture of semiconductors and electronics, has reached another milestone in its long and successful history. The company has aligned all its segments, business units and regions worldwide under one…
Laser separation technique: Multiple Laser Beam Technology (MLBT)
The two main requirements for any separation process are a superior cutting quality – in terms of visual appearance and structural integrity of the cut – and a low throughput time. The latter depends to a great extend on the…
First high power ultra-short pulse LASER1205 grooving system shipped
Last week ALSI shipped the first high power ultra-short pulse LASER1205 grooving system to a customer with a leading position in the display industry. By the application of new technology and close customer collaboration new…
Multibeam Process
The two main requirements for any separation process are a superior cutting quality – in terms of visual appearance and structural integrity of the cut – and a low throughput time. The latter depends to a great…
Active Mounts
As in all precision machines, the accelerating mass of the stage introduces deformation and vibrations in the frames, negatively influencing attainable accuracy. This effect is counteracted by an active mount system: linear motors generate counter forces in the frame…
LASER1205 >> UV GROOVING
Multi beam Matrix laser grooving process allows full removal (grooving) of the top layers (Low-K, Metals and passivation, etc). The multi beam matrix grooving process creates a U-Shape groove profile with consistent industry standard quality (low burr, no…