We are ASMPT
ASMPT the leading global provider of hardware and software solutions for the manufacture of semiconductors and electronics, has reached another milestone in its long and successful history. The company has aligned all its segments, business units and regions worldwide under one…
Laser separation technique: Multiple Laser Beam Technology (MLBT)
The two main requirements for any separation process are a superior cutting quality – in terms of visual appearance and structural integrity of the cut – and a low throughput time. The latter depends to a great extend on the…
First high power ultra-short pulse LASER1205 grooving system shipped
Last week ALSI shipped the first high power ultra-short pulse LASER1205 grooving system to a customer with a leading position in the display industry. By the application of new technology and close customer collaboration new frontiers…
Multibeam Process
The two main requirements for any separation process are a superior cutting quality – in terms of visual appearance and structural integrity of the cut – and a low throughput time. The latter depends to a great extend…
Active Mounts
As in all precision machines, the accelerating mass of the stage introduces deformation and vibrations in the frames, negatively influencing attainable accuracy. This effect is counteracted by an active mount system: linear motors generate counter forces in the frame that…
LASER1205 >> UV GROOVING
Multi beam Matrix laser grooving process allows full removal (grooving) of the top layers (Low-K, Metals and passivation, etc). The multi beam matrix grooving process creates a U-Shape groove profile with consistent industry standard quality (low burr, no chipping,…
Matrix Grooving
Issue:
As metal layers are increasing in thickness a single pass single row pass is not sufficient to achieve the required grooving depth.
Solution:
Laser power will increase Matrix DOE’s allow to utilize the available laser power and…
IR DICING
ASMPT is the inventor of multi beam semiconductor dicing. With more than 20 years of multi beam laser process experience in high volume manufacturing many billions of parts have been processed. Utilizing the strength of the multi beam process, low power per beam but using many beam to allow high material removal rate with a small (<3um) heat…
V-DOE DICING FOR THIN SI WAFERS
ASMPT has developed a proprietary process with a unique V-DOE Multi beam process for dicing of thin silicon (<<100 µm) wafers with a low CoO while achieving a high die strength (typically >500 MPa). Read more
Machine Concepts
The design of ALSI machine platform has been made with productive and accurate laser dicing of semiconductor wafers in mind. It incorporates over 12 years of experience in laser dicing of wafers originally at NXP (formerly…