Lancering Trimos V1/V1+ hoogtemeters

Met trots presenteren wij u de nieuwste Trimos verticale meetinstrumenten op instapniveau, de V1 en V1+.  Deze instapinstrumenten zijn meesterlijk ontworpen en zijn de perfecte brug tussen de traditionele wereld van hoogteschuifmaten en de geavanceerde wereld van digitale hoogtemeters. Een echt voorbeeld van de Zwitserse toewijding aan precisie, betrouwbaarheid en gebruiksvriendelijk ontwerp.

Extend Your Range with Digital Twins for Thermal Battery Management

Laptops, smartphones, electric vehicles, power tools, or your toothbrush: mobile applications like this need stored mobile energy to fulfill their tasks. For larger systems, like battery electric vehicles, the mobile energy requirements grow profoundly, and energy storage capacity plays the starring role in broad acceptance of e-mobility. But what is so special about batteries in mobile applications and what makes…

Introducing handheld 3D scanners from Hexagon

Meet the first handheld 3D scanners in the Hexagon product range – ATLASCAN Max and MARVELSCAN. Engineered to redefine how you perceive 3D scanning and data capture, Hexagon’s devices revolutionise the standard feature set while addressing customer challenges head-on.

vibration isolation for nanometer measurement device

In this article, we present the model-based design steps for a high-performance vibration isolation system to support a metrology frame. During the design phase, several improvements were shown to increase the vibration isolation performance. The design requirements for the individual spring and damper components have been derived from the relatively simple model. To conclude, the realisation…

Calibration of reference materials

OMT Solutions offers calibration services for optical components. Our reference mirrors for the solar wavelength range (250-2500 nm) and the infrared range (range 2.5µm – 50 µm) are worldwide used by different R&D companies and institutes. Read more

World-record chip placement

Sioux Technologies has a long-standing partnership with ITEC, developing and producing its record-breaking machines. ITEC’s wire bonders can place a mind-blowing 90,000 chips per hour with 5-micron accuracy. Read more