Taking on Challenges in Integrated Photonics Packaging with Automated Assembly and Connection Technology

Testing, assembling, and packaging of photonic devices requires highly efficient systems. Alignment, especially array alignment, is one of the most significant cost factors, as it is essential at several stages of the production process to ensure throughput and manage production costs. For maximum performance, the optimal combination of accuracy, speed, and intelligent automation is needed. Positioning…

The Broadest Range of 6-Axis Hexapod Positioning Systems

PI’s precision hexapods are based on more than three decades of design and manufacturing experience. Our broad range of drive technologies, from piezoelectric to electromagnetic, enables us to offer hexapods for a wide range of specification requirements and installation situations, when combined with the appropriate sensors, software, and motion control. Read more

Enabling Fully Automated Testing of SiPh at Wafer Level

The economical mass production of silicon photonics (SiPh) components requires high-speed alignment with nanometer accuracies: With thousands of photonic structures on one wafer, the faster the alignment of the signal-carrying optical fibers to the photonic circuits, the faster and thus more economical testing becomes. Probing solutions must combine high speed and precision with adequate sensor technologies…

The Evolution of Photonics Alignment Techniques from Manual to Algorithm-Assisted, Automated Systems

The photonics industry is clearly trending towards rapidly increasing production scale, with three orders of magnitude expected in the near future. Whether the challenge is economical, scalable manufacturing of multichannel silicon photonic (SiPh) devices, assembling increasingly sophisticated miniature cameras, or transmitting high-speed data across thousands of miles of space: Alignment is crucial for effectiveness, performance, and…

Taking on Challenges in Integrated Photonics Packaging with Automated Assembly and Connection Technology

Testing, assembling, and packaging of photonic devices requires highly efficient systems. Alignment, especially array alignment, is one of the most significant cost factors, as it is essential at several stages of the production process to ensure throughput and manage production costs. For maximum performance, the optimal combination of accuracy, speed, and intelligent automation is needed. Positioning…

Film Metrology in Wafer Inspection

For every type of wafer, key prerequisites include uniform substrate and device layer thickness, along with a minimal defect density. Moreover, the wafer’s electrical resistivity must closely align with specified standards. Certain films necessitate characterization, especially for assessing thickness, electrical resistivity, and surface quality and roughness. Reliable and fast measurement technologies help to prevent yield losses…

Hybrid Piezo Motor Principle for Increased Range and Dynamics, with Integrated Wafer Lift

Dynamic positioning, scanning, and alignment with precision down to the subnanometer realm is critical to success in wafer inspection and metrology.As feature sizes in semiconductor manufacturing shrink and design complexity increases, the demands on the motion systems continue to grow. Metrology processes are therefore highly dependent on precise wafer positioning solutions to enable the fast and…