DragonFly NIR Spectrometer

The DragonFly (DF) Series spectrometers feature advanced digital light processing (DLP) technology, utilizing a programmable digital micro-mirror device (DMD) chip paired with a high-sensitivity Hamamatsu G12180 series 1 mm InGaAs photodiode. Read more

Introducing THE DP MAX SERIES

The DP MAX was developed to move high-energy applications beyond legacy lamp-pumped lasers. Built on a diode pulse-pumped, solid-state, Q-switched architecture, the DP MAX delivers high pulse energy with significantly higher efficiency, improved stability, and a much longer operating lifetime. Read more [Picture source: Delta Photonics on linkedin.com]

Introducing the Gentec-EO Data Viewer

We’re excited to announce a powerful new tool from Gentec-EO: the Data Viewer. Say goodbye to navigating complex Excel menus — now you can chart and analyze your log data in seconds. Simply drag and drop your log file into the intuitive interface, and you’re ready to go! Read more

Advancement Powered By Piezo

As semiconductor manufacturing pushes the limits of miniaturization and precision, piezoelectric systems are emerging as key enablers of next-generation chip production.This article explores how piezo actuators and positioners —known for sub-nanometer accuracy and high-speed responsiveness— are being integrated across front-end and back-end processes, from wafer inspection and polishing to defect analysis and fine-pitch bonding.Despite challenges like hysteresis and environmental constraints,…

A New Benchmark in Sub-Nanosecond Laser Technology

Photonics Industries has unveiled the SN-1064-250, a groundbreaking sub-nanosecond laser system delivering 250W average power, 2.5 mJ pulse energy, and adjustable pulse widths from <100 ps to 5 ns. This ultra-compact, all-in-one monolithic laser head supports harmonics at 532 nm, 355…

Increased Dynamics with Double Pulse Decoupling: A Breakthrough in Air Bearing Technology

A new generation of air bearing positioning systems, featuring double pulse decoupling in both X and Y axes, is setting new standards for precision and speed in wafer-level link trimming. Developed through collaboration between 3D-Micromac and Eitzenberger, this technology enables extremely accurate and dynamic motion control. These features are crucial for advanced semiconductor manufacturing.