Electronic components and their structures are becoming smaller and smaller, making it all the more difficult to bond them. Conventional processes have long since reached the limits of what they can do in this area, but the Impulse PrintingTM process developed by Dutch start-up Fonontech is bringing something new. It enables advanced packaging of semiconductors in 3D structures in the micrometer range. XFC technology components from Beckhoff and EtherCAT are key in this process. Read more
