De visie achter Crux, verteld door onze founder Richard Vialle
MetalFAB 300 Flex: The Most Flexible & Affordable Solution in Metal Additive Manufacturing
At Additive Industries, we are committed to driving the adoption of large systems by mitigating the risks associated with adoption and expanding the horizons of industrial applications. Our solution lies in revolutionizing the…
Bedrijfsfilm Andes Meettechniek
Vacuum Qualification System (CUBE150)
D&M Vacuumsystemen BV has developed a new high vacuum qualification system. This system is especially designed in order to perform a final vacuum qualification of materials and/or modules prior to assembly within a high-vacuum environ- ment. Furthermore, implementing this equipment will also result…
SRBA Group breidt internationaal uit met overname in de VS
De SRBA Group heeft per 22 oktober 2024 een meerderheidsbelang van 60% verworven in het Amerikaanse bouwbedrijf Corporate Construction Inc., gespecialiseerd in het ontwerpen, engineering en bouwen van cleanroom faciliteiten, in de ruimste zin van het woord. Met deze strategische deelname onderstreept SRBA haar groeistrategie en versterkt haar aanwezigheid in de internationale Controlled Environment-markt, met een focus op de Hightech- en…
Coil development for and with the customer
Coil development is an important process that requires careful planning to achieve the desired performance and reliability. During the feasibility phase, experienced coil manufacturers understand the challenges that may arise. The cooperation with a customer-specific coil manufacturer during the feasibility phase and for sampling is of great importance. Read more
TEMPUS™ technology: build twice as fast, with no compromise on part quality
TEMPUS technology is a new scanning algorithm for the RenAM 500 series of metal additive manufacturing (AM) systems, which delivers a substantial increase in AM productivity without compromising on part quality. This technology allows the system lasers to fire whilst the powder recoater is moving, removing up to nine seconds of build time from every layer. With builds frequently containing thousands of…
Taking on Challenges in Integrated Photonics Packaging with Automated Assembly and Connection Technology
Testing, assembling, and packaging of photonic devices requires highly efficient systems. Alignment, especially array alignment, is one of the most significant cost factors, as it is essential at several stages of the production process to ensure throughput and manage production costs. For maximum performance, the optimal combination of accuracy, speed, and intelligent automation is needed. Positioning…
The Rising Demand for Efficient Solar Solutions
As the global community shifts towards renewable energy sources, solar voltaics have emerged as a key player in the sustainable energy landscape. This transition has sparked a growing need for advancements in solar panel technology, focusing on increasing efficiency and extending lifespan. Central to these advancements is the role of Secondary Ion Mass Spectrometry (SIMS) in pushing the boundaries of photovoltaic layer…
MULTI-DOF technology for positioning accuracy better than 200 nm
The accuracy of production equipment plays a vital role in the performance of the manufactured components, especially in the electronics and semiconductor manufacturing industry. The memory and computing capacity of today’s computer chips depend on ever greater accuracy in front-end and downstream back-end production processes, including hybrid bonding and advanced packaging.