Semiconductor equipment cybersecurity is moving from a common baseline to risk-based security by design
The major revision of SEMI E187 introduces three cumulative Security Levels, SL1 to SL3, allowing fabs and equipment suppliers to select a target security profile based on equipment criticality, connectivity exposure, and risk. Read more [Picture source: Agileo Automation on linkedin.com]
Equipment Data Acquisition – Global semiconductor OEMs required to transition to SEMI’s EDA
With the growing demand for data to improve yield in tier-one fabs, advanced packaging, and 3D integration, EDA is becoming a baseline expectation for equipment entering the world’s most advanced fabs. There is therefore some urgency for semiconductor equipment OEMs to start working on an EDA adoption path that will deliver compliant production machines to…
R2D Automation: Achieving complete software development autonomy with Agileo’s A²ECF-SEMI framework
R2D Automation is a leading developer and manufacturer of wafer handling equipment as well as automation solutions for furnaces. Back in 2013, the company was using outdated, in-house developed software. What R2D Automation really needed was a solid software foundation to start developing communication systems for the fab equipment they manufactured. They integrated Agileo…
From Static Compliance to Operational Proof: The Next Phase of Semiconductor Manufacturing Cybersecurity
Semiconductor manufacturing is moving from static compliance to operational proof. The question is no longer simply, “Is this equipment compliant for delivery?” It is now, “Can this equipment continuously demonstrate that it is operating securely and reliably?” Read more [Picture source: Agileo Automation on linkedin.com]
From Lab to Fab, Predictably
Have you ever had key staff leave mid-project, creating delivery risk and loss of knowledge? Or software projects go over budget, with limited visibility early on? Reliability is a strong concern for semiconductor equipment manufacturers. Customers do not only evaluate whether a machine works in the lab. They also evaluate whether it can be deployed,…
Reducing deployment risks of automated semiconductor equipment
RECIF Technologies is a leader in the design, manufacture, and distribution of fully automated atmospheric handling equipment, wafer sorters, and front-end equipment modules (EFEMs). The French company called upon Agileo Automation’s combined Speech Scenario and E84 PIO Box solution to help reduce new fab manufacturing equipment deployment risks at global client sites by quickly…
Why is Equipment Data Acquisition (EDA) so crucial for tier-one wafer fabs and advanced packaging facilities?
CEO Marc ENGEL explains how Agileo Automation’s newly launched Agil’EDA high-performance connectivity software solution helps semiconductor equipment OEMs meet increasing fab requirements for EDA/Interface A Freeze 2 enabling the collection of structured, high-volume equipment data. Find out in this latest video interview with Silicon Semiconductor! Picture source: Agileo Automation on linkedin.com]
Reduce risks & accelerate commissioning with Agileo Automation
Have you ever seen a semiconductor tool arrive at the fab and then spend weeks before passing Site Acceptance Test? Unfortunately, this is not an April Fools’ Day joke! Read more [Picture source: Agileo Automation on linkedin.com]
Agileo Automation launches Agil’EDA
Agileo Automation unveiled Agil’EDA, a new software implementing Equipment Data Acquisition (EDA), the latest SEMI standard also known as Interface A. This solution enables semiconductor equipment manufacturers to meet the evolving high-performance connectivity requirements of tier-one fabs and Advanced Packaging facilities. As semiconductor manufacturing moves towards higher levels of automation and data-driven optimization, fab…
Wish to learn more about how you can accelerate the integration and validation of your hybrid semiconductor and traditional manufacturing tools on your production lines?
In this video interview with Silicon Semiconductor Editor Phil Alsop, Agileo Automation CEO Marc ENGEL explains how the company’s Agil’SECS-II library helps fabs and OEMs integrate semiconductor tools with the MES in hybrid manufacturing sites, ensuring faster time to market, lower integration costs, and reduced deployment risks. [Picture source: Agileo Automation on linkedin.com]