Reducing deployment risks of automated semiconductor equipment
RECIF Technologies is a leader in the design, manufacture, and distribution of fully automated atmospheric handling equipment, wafer sorters, and front-end equipment modules (EFEMs). The French company called upon Agileo Automation’s combined Speech Scenario and E84 PIO Box solution to help reduce new fab manufacturing equipment deployment risks at global client sites by quickly and securely…
Why is Equipment Data Acquisition (EDA) so crucial for tier-one wafer fabs and advanced packaging facilities?
CEO Marc ENGEL explains how Agileo Automation’s newly launched Agil’EDA high-performance connectivity software solution helps semiconductor equipment OEMs meet increasing fab requirements for EDA/Interface A Freeze 2 enabling the collection of structured, high-volume equipment data. Find out in this latest video interview with Silicon Semiconductor! Picture source: Agileo Automation on linkedin.com]
Reduce risks & accelerate commissioning with Agileo Automation
Have you ever seen a semiconductor tool arrive at the fab and then spend weeks before passing Site Acceptance Test? Unfortunately, this is not an April Fools’ Day joke! Read more [Picture source: Agileo Automation on linkedin.com]
Agileo Automation launches Agil’EDA
Agileo Automation unveiled Agil’EDA, a new software implementing Equipment Data Acquisition (EDA), the latest SEMI standard also known as Interface A. This solution enables semiconductor equipment manufacturers to meet the evolving high-performance connectivity requirements of tier-one fabs and Advanced Packaging facilities. As semiconductor manufacturing moves towards higher levels of automation and data-driven optimization, fab owners…
Wish to learn more about how you can accelerate the integration and validation of your hybrid semiconductor and traditional manufacturing tools on your production lines?
In this video interview with Silicon Semiconductor Editor Phil Alsop, Agileo Automation CEO Marc ENGEL explains how the company’s Agil’SECS-II library helps fabs and OEMs integrate semiconductor tools with the MES in hybrid manufacturing sites, ensuring faster time to market, lower integration costs, and reduced deployment risks. [Picture source: Agileo Automation on linkedin.com]
The Convergence of Front-end and Back-end: Navigating the Advanced Packaging Era
Happy to share our latest contributed viewpoint entitled “The Convergence of Front-end and Back-end: Navigating the Advanced Packaging Era” authored by CEO Marc ENGEL and published in the February issue of Semiconductor Packaging News. Read more [Picture source: Agileo Automation on linkedin.com]
Accelerate your time to market
In the global semiconductor equipment race, speed is not a nice to have. It’s a competitive advantage! For semiconductor equipment OEMs fighting for market leadership in a fast-paced industry, each month of reduced development and deployment timeline means… Read…
European cybersecurity regulation is shifting from documentation compliance to lifecycle responsibility
Agileo Automation’s first byline of 2026 is out!Our executive viewpoint “EU Cybersecurity Regulatory Evolution and Its Impact on Semiconductor Manufacturing Equipment” authored by Director of Product Innovation Dr. Fahad Golra has just been published as part of the 2026 Outlook special supplement to the January issue of Semiconductor Digest. Read more [Picture…
Agileo Automation provides control and connectivity solutions for production machines based on deep expertise in the semiconductor industry
Our customers are mainly OEMs (original equipment manufacturers) of production machines that equip the factories of some of the world’s largest industrial companies. A long-standing expert in the semiconductor industry, Agileo Automation also serves other industries such as aerospace, advanced manufacturing, and testing machines. We support our customers with their production equipment…
Agileo Automation launches Agil’SECS-II
At SEMICON Europa 2025, Agileo Automation unveiled Agil’SECS-II, a new SECS-II library featuring built-in SEMI standard communication for semiconductor OEMs, multi-industry fabs, labs, and pilot lines. This driver enables an MES to accelerate the integration and validation of hybrid semiconductor and traditional manufacturing tools on production lines,…