The Convergence of Front-end and Back-end: Navigating the Advanced Packaging Era
Happy to share our latest contributed viewpoint entitled “The Convergence of Front-end and Back-end: Navigating the Advanced Packaging Era” authored by CEO Marc ENGEL and published in the February issue of Semiconductor Packaging News. Read more [Picture source: Agileo Automation on linkedin.com]
Accelerate your time to market
In the global semiconductor equipment race, speed is not a nice to have. It’s a competitive advantage! For semiconductor equipment OEMs fighting for market leadership in a fast-paced industry, each month of reduced development and deployment timeline means…
Agileo Automation’s first byline of 2026 is out!Our executive viewpoint “EU Cybersecurity Regulatory Evolution and Its Impact on Semiconductor Manufacturing Equipment” authored by Director of Product Innovation Dr. Fahad Golra has just been published as part of the 2026 Outlook special supplement to the January issue of Semiconductor Digest. Read more…European cybersecurity regulation is shifting from documentation compliance to lifecycle responsibility
Agileo Automation provides control and connectivity solutions for production machines based on deep expertise in the semiconductor industry
Our customers are mainly OEMs (original equipment manufacturers) of production machines that equip the factories of some of the world’s largest industrial companies. A long-standing expert in the semiconductor industry, Agileo Automation also serves other industries such as aerospace, advanced manufacturing, and testing machines. We support our customers with their production…
Agileo Automation launches Agil’SECS-II
At SEMICON Europa 2025, Agileo Automation unveiled Agil’SECS-II, a new SECS-II library featuring built-in SEMI standard communication for semiconductor OEMs, multi-industry fabs, labs, and pilot lines. This driver enables an MES to accelerate the integration and validation of hybrid semiconductor and traditional manufacturing tools on production…
How can OEMs avoid minor carrier delivery issues leading to costly downtime in highly automated fabs?
Discover how Agileo Automation’s lightweight E84 PIO Box is designed to rigorously validate nominal and error cases, ensuring seamless operations and fast recovery, benefiting both equipment manufacturers and facilities alike! Read more and watch the video
Two-day professional training course on OPC UA
In semiconductor manufacturing, #SECSGEM, #GEM300, and #EDA standards remain the backbone of front-end equipment communication in fabs. However, sub-fab environments, covering areas such as vacuum systems, abatement, and facility equipment, are increasingly adopting #OPCUA to achieve interoperability, stronger cybersecurity, and consistent data exchange between heterogeneous systems. Read more [Picture source:…
Interested in learning more about EDA and Interface-A?
I recommend this article from Fahad Golra in Silicon Semiconductor. Agileo Automation is actively integrating EDA Freeze 2 in its A²ECF-SEMI automation framework and preparing for Freeze 3. Read more
RECIF Technologies adopts Agileo’s combined Speech Scenario and E84 PIO Box solution
Agileo Automation announced at SEMICON West 2025 that RECIF Technologies has adopted its combined Speech Scenario and E84 PIO Box solution to test its wafer handling and tracking equipment for E84 and SECS/GEM compliance. The global company headquartered in Toulouse Blagnac, France, which specializes in the design, manufacturing, and installation of automated equipment for…
Mission OTPaaS successfully achieved!
Four years ago, alongside multiple industrial and academic partners, Agileo Automation embarked on the OTPaaS project, an ambitious challenge to build a sovereign, energy-efficient, edge-to-cloud platform for industrial data, with the aim of enabling seamless, secure data continuity from…