Zuken Joins IBM Research AI Hardware Center to Develop Next-Generation AI Hardware Solutions
Zuken Inc. announced an agreement with IBM to join the IBM Research AI Hardware Center as a commercial member. The IBM Research AI Hardware Center, a global research hub headquartered at the Albany NanoTech Complex in Albany, NY, aims to develop next-generation chips and systems, including advanced semiconductor packaging, that support the processing power and unprecedented speed that AI requires….
Common Pitfalls of Wire Harness Design and How to Avoid Them
Wire harnesses are the hidden nervous system of modern electrical systems. From automobiles to the space shuttle, from agricultural vehicles to medical equipment, anything that carries power and signals across multiple electrical components relies on wire harnesses to link it all together. Optimized wire harness design is getting increasingly complex as our cars and machines incorporate smart manufacturing and advanced…
The Future of Augmented Reality
Augmented reality (AR) is poised to transform everyday life by optimizing how we receive and interact with information. While the modern world is already filled with constant notifications and digital content, AR aims to provide information seamlessly and efficiently rather than add to the distractions. Read more
The Top PCB Design Trends to Watch in 2025
The field of PCB design continues to evolve as advancements in technology and shifting market demands push the boundaries of what’s possible. By 2025, several key trends are set to shape the industry, from the integration of AI tools to new materials and processes aimed at sustainability and performance optimization. The following article provides an overview…
Supply Chain Risk Management in PCB Design with SiliconExpert and CR-8000 Integration
Effective supply chain risk management has become essential for design engineers and procurement teams, especially as issues around component availability, lead times, and obsolescence continue to affect project timelines and costs. Zuken’s integration with SiliconExpert, within the CR-8000 and DS-CR design environments, offers a structured approach to supply chain risk management by supporting intelligent component selection and library management, ultimately…
Advancing Mobile Robotics Applications
Sherpa Mobile Robotics is a leading player in the field of autonomous mobile robotics, specializing in the automation of intralogistics flows. With a workforce of 40 employees and a turnover of €3 million in 2023, Sherpa Mobile Robotics is recognized for its innovative solutions. To address significant challenges in managing the growing number of variations in…
Designing the Future: Challenged and Innovations in Industrial IIoT
Industrial IoT is setting new standards in manufacturing, but it comes with its set of challenges. From cybersecurity concerns to the integration of legacy systems, our recent blog unpacks these complexities and showcases…
Electrifying Transportation: Challenges and Opportunities
Electrifying transportation is one of the significant technology initiatives of this era. Breakthrough innovation in transportation was rare in the last quarter of the 20th century. However, during the last few decades, battery and high-power semiconductor technology have improved significantly. Read more
Harness Builder 2025 for E3.series: Enhancements You Don’t Want to Miss
Streamline Your Design Process with Harness Builder 2025! Unlock new efficiencies in wire harness design with the latest release from E3.series. Our 2025 updates reduce manual efforts, enhance system integration, and boost accuracy across your projects.
Stack-up Design and Track Impedance Control for Optimal PCB Performance
The arrangement of the various layers in a multilayer PCB, commonly referred to as layer stack-up, and careful attention to the electrical impedance of the tracks are crucial factors for achieving robust high-speed board designs. Poor choices in either area can lead to significant performance issues, such as signal loss, electromagnetic interference issues (EMI), and ultimately delays and higher costs…