As semiconductor manufacturing pushes the limits of miniaturization and precision, piezoelectric systems are emerging as key enablers of next-generation chip production.
This article explores how piezo actuators and positioners —known for sub-nanometer accuracy and high-speed responsiveness— are being integrated across front-end and back-end processes, from wafer inspection and polishing to defect analysis and fine-pitch bonding.
Despite challenges like hysteresis and environmental constraints, piezo technology offers scalable solutions for improving yield, reducing defects, and supporting advanced architectures such as 3D chip designs.
Read the full article from Mikroniek
