For every type of wafer, key prerequisites include uniform substrate and device layer thickness, along with a minimal defect density. Moreover, the wafer’s electrical resistivity must closely align with specified standards. Certain films necessitate characterization, especially for assessing thickness, electrical resistivity, and surface quality and roughness. Reliable and fast measurement technologies help to prevent yield losses by detecting defects in an early stage, and thereby reducing costs. PI is currently developing motion solutions for wafer positioning to facilitate the measurement of crucial wafer attributes. Read more
