Dynamic positioning, scanning, and alignment with precision down to the subnanometer realm is critical to success in wafer inspection and metrology.
As feature sizes in semiconductor manufacturing shrink and design complexity increases, the demands on the motion systems continue to grow. Metrology processes are therefore highly dependent on precise wafer positioning solutions to enable the fast and reliable analysis of defects or particles at each step of the manufacturing process to prevent yield loss. PI offers proven wafer scanning subsystems that take advantage of piezo technology to meet demanding process requirements where conventional electromagnetic solutions reach their limits. Read more
