ITEC’s wire- and die-bonders do their job at an incredible speed. They can place up to 90,000 chips per hour on a substrate, which is by far the world record. Perhaps even more impressive, is that this is done with an accuracy of five micrometres. Sioux Technologies has been working with ITEC since 2008, contributing to the development and prototyping of this high-tech equipment. Meanwhile, the next step in this partnership has been taken; Sioux is responsible for the construction of the Tagliner. Read more
