The New Dimension of Precision Automation

Throughput, precision, availability, reliability, and yield – the variety of technologies, the long-term experience in precision positioning, and a modular approach make it possible for PI to react in an application-specific manner to requirements in order to support system integrators and OEMs worldwide in reaching the requested process and machine performances. Read…

Taking on Challenges in Integrated Photonics Packaging with Automated Assembly and Connection Technology

Testing, assembling, and packaging of photonic devices requires highly efficient systems. Alignment, especially array alignment, is one of the most significant cost factors, as it is essential at several stages of the production process to ensure throughput and manage production costs. For maximum performance, the optimal combination of accuracy, speed, and intelligent automation is needed. Positioning…

The Broadest Range of 6-Axis Hexapod Positioning Systems

PI’s precision hexapods are based on more than three decades of design and manufacturing experience. Our broad range of drive technologies, from piezoelectric to electromagnetic, enables us to offer hexapods for a wide range of specification requirements and installation situations, when combined with the appropriate sensors, software, and motion control. Read more

Enabling Fully Automated Testing of SiPh at Wafer Level

The economical mass production of silicon photonics (SiPh) components requires high-speed alignment with nanometer accuracies: With thousands of photonic structures on one wafer, the faster the alignment of the signal-carrying optical fibers to the photonic circuits, the faster and thus more economical testing becomes. Probing solutions must combine high speed and precision with adequate sensor technologies to avoid direct contact…

The Evolution of Photonics Alignment Techniques from Manual to Algorithm-Assisted, Automated Systems

The photonics industry is clearly trending towards rapidly increasing production scale, with three orders of magnitude expected in the near future. Whether the challenge is economical, scalable manufacturing of multichannel silicon photonic (SiPh) devices, assembling increasingly sophisticated miniature cameras, or transmitting high-speed data across thousands of miles of space: Alignment is crucial for effectiveness, performance, and practicality. As photonics increasingly…

Taking on Challenges in Integrated Photonics Packaging with Automated Assembly and Connection Technology

Testing, assembling, and packaging of photonic devices requires highly efficient systems. Alignment, especially array alignment, is one of the most significant cost factors, as it is essential at several stages of the production process to ensure throughput and manage production costs. For maximum performance, the optimal combination of accuracy, speed, and intelligent automation is needed. Positioning accuracies with submicron or…

Film Metrology in Wafer Inspection

For every type of wafer, key prerequisites include uniform substrate and device layer thickness, along with a minimal defect density. Moreover, the wafer’s electrical resistivity must closely align with specified standards. Certain films necessitate characterization, especially for assessing thickness, electrical resistivity, and surface quality and roughness. Reliable and fast measurement technologies help to prevent yield losses by detecting defects in…